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 Data Sheet June 26, 2009
HW006/010/012 Series Power Modules; dc-dc Converters 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Features
RoHS Compliant
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Compatible with RoHS EU Directive 200295/EC (-Z Versions) Compatible in RoHS EU Directive 200295/EC with lead solder exemption (non -Z versions) Delivers up to 12A output current High efficiency: 90% at 3.3V full load (VIN = 48V) Small size and low profile: 47.2 mm x 29.5 mm x 8.50 mm (1.86 in x 1.16 in x 0.335 in) Low output ripple and noise Exceptional thermal performance High reliability: MTBF > 4.5M hours at 25 C Remote On/Off positive logic (primary referenced) Constant switching frequency (285 KHz typical) Output overvoltage and overcurrent protection Overtemperature protection Input undervoltage lockout Adjustable output voltage ( 10%) Surface mount or through-hole package
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Applications
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Distributed Power Architectures
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Wireless Networks
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Access and Optical Network Equipment
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Enterprise Networks
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Latest generation IC's (DSP, FPGA, ASIC) and Microprocessor-powered applications.
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Options
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Remote On/Off negative logic Surface-mount package (-S Suffix) Basic Insulation (-B Suffix)
Meets the voltage and current requirements for ETSI 300-132-2 and complies with and is approved for Basic Insulation rating per IEC60950 3rd (-B version only) UL* 60950 Recognized, CSA C22.2 No. 60950-00 Certified, and VDE 0805 (IEC60950, 3rd edition) Licensed CE mark meets 73/23/EEC and 93/68/EEC directives ISO** 9001 and ISO14001 certified manufacturing facilities
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Description
The HW series power modules are isolated dc-dc converters that can deliver up to 12A of output current and provide a precisely regulated output voltage over a wide range of input voltages (VI = 36 V to 75 Vdc for HW modules). The modules achieve full load efficiency of 90% at 3.3 V output voltage. The open frame modules, available in both surface-mount and through-hole packaging, enable designers to develop cost- and space-efficient solutions. Standard features include remote On/Off, output voltage adjustment, overvoltage, overcurrent and overtemperature protection.
* ** UL is a registered trademark of Underwriters Laboratories, Inc. CSA is a registered trademark of Canadian Standards Association. VDE is a trademark of Verband Deutscher Elektrotechniker e.V. This product is intended for integration into end-use equipment. All the required procedures for CE marking of end-use equipment should be followed. (The CE mark is placed on selected products.) ISO is a registered trademark of the Internation Organization of Standards
Document No: ADS02-006EPS ver.1.4 PDF Name: fds03-0031.pdf
Data Sheet June 26, 2009 Absolute Maximum Ratings
HW006/010/012 Series Power Modules; dc-dc Converters 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliabiltiy.
Parameter Input Voltage:Continuous Transient (100ms) Operating Ambient Temperature (See Thermal Considerations section) Storage Temperature Device HW HW All All Symbol VI VI, trans TA Tstg Min -0.3 -- -40 -55 Max 80 100 85 125 Unit Vdc Vdc C C
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
Parameter Operating Input Voltage Maximum Input Current (VI = 0 V to 75 V; IO = IO, max) Inrush Transient Input Reflected Ripple Current, peak-peak (5 Hz to 20 MHz, 12 H source impedance See Test configuration section) Input Ripple Rejection (120 Hz)
Device HW HW All All
Symbol VIN II, max I2 t II
Min 36
Typ 48
Max 75 1.6 1
Unit Vdc Adc A 2s mAp-p
3
All
50
dB
CAUTION: This power module is not internally fused. An input line fuse must always be used. This power module can be used in a wide variety of applications, ranging from simple stand-alone operation to an integrated part of a sophisticated power architecture. To preserve maximum flexibility, internal fusing is not included however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a time-delay fuse with a maximum rating of 5 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer's data sheet for further information.
Lineage Power
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Data Sheet June 26, 2009
HW006/010/012 Series Power Modules; dc-dc Converters 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Electrical Specifications (continued)
Parameter Output Voltage Set Point (VI = 48 Vdc; IO = IO, min to IO, max, TA = 25 C) Device HW012A0P1 HW012A0M1 HW012A0Y1 HW010A0G1 HW010A0F1 HW006A6A1 HW012A0P1 HW012A0M1 HW012A0Y1 HW010A0G1 HW010A0F1 HW006A6A1 All All All Symbol Vo, set Vo, set Vo, set Vo, set Vo, set Vo, set VO VO VO VO VO VO -- -- -- Min 1.17 1.46 1.75 2.46 3.25 4.92 1.15 1.44 1.73 2.42 3.2 4.85 -- -- -- Typ 1.2 1.5 1.8 2.5 3.3 5.0 -- -- -- -- -- -- -- -- 0.2 Max 1.23 1.54 1.85 2.54 3.35 5.08 1.25 1.56 1.87 2.57 3.4 5.15 0.1 10 -- Unit Vdc Vdc Vdc Vdc Vdc Vdc Vdc Vdc Vdc Vdc Vdc Vdc %, VO, set mV %, VO, set
Output Voltage (Over all operating input voltage, resistive load, and temperature conditions at steady state until end of life.)
Output Regulation: Line (VI = VI, min to VI, max) Load (IO = IO, min to IO, max) Temperature (TA = TA, min to TA, max) Output Ripple and Noise Measured across 10F Tantalum, 1F Ceramic, VI = VI, nom TA = 25 C, IO = IO, max See test Configuration section RMS (5 Hz to 20 MHz bandwidth) Peak-to-peak (5 Hz to 20 MHz bandwidth) External Load Capacitance Output Current (At Io < Io,min, the output ripple may exceed the maximum specifications. All modules shall operate at no load without damage and without exceeding 110% of VO, set.) Output Current-limit Inception (VO = 90% of VO, set)
All All HW006A6A1 All others HW012A0P1 HW012A0M1 HW012A0Y1 HW010A0G1 HW010A0F1 HW006A6A1 HW012A0P1 HW012A0M1 HW012A0Y1 HW010A0G1 HW010A0F1 HW006A6A1 HW012A0P1 HW012A0M1 HW012A0Y1 HW010A0G1 HW010A0F1 HW006A6A1 HW012A0P1 HW012A0M1 HW012A0Y1 HW010A0G1 HW010A0F1 HW006A6A1 All HW012A0P1 HW012A0M1 HW012A0Y1 HW010A0G1 HW010A0F1 HW006A6A1 CO, max CO, max IO IO IO IO IO IO IO, lim IO, lim IO, lim IO, lim IO, lim IO, lim IO, s/c IO, s/c IO, s/c IO, s/c IO, s/c IO, s/c h h h h h h fSW h h h h h h
-- -- 0 0 0.15 0.15 0.15 0.05 0.05 0.05 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- --
8 40 -- -- -- -- -- -- -- -- 18 18 18 12 12 8 20 20 20 17 17 13 82 83 85 89 90 91 285 82 83 85 89 90 91
20 75 470 1000 12 12 12 10 10 6.6 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- --
mVrms mVp-p F F Adc Adc Adc Adc Adc Adc Adc Adc Adc Adc Adc Adc Adc Adc Adc Adc Adc Adc % % % % % % kHz % % % % % %
Output Short-circuit Current (Average) VO = 0.25 V
Efficiency (VI = VIN, nom; IO = IO, max), TA = 25 C
Switching Frequency Efficiency (VI = VIN, nom; IO = IO, max), TA = 25 C
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Data Sheet June 26, 2009
HW006/010/012 Series Power Modules; dc-dc Converters 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Electrical Specifications (continued)
Parameter Dynamic Load Response (di/dt = 0.1 A/ s, VI = VI, nom, TA = 25 C) Load change from IO = 50% to 75% of IO, max, Peak Deviation Settling Time (VO < 10% of peak deviation) Load Change from IO = 50% to 25% of IO, max, Peak Deviation Setting Time (VO < 10% peak deviation)
Device
Symbol
Min
Typ
Max
Unit
All All All All
-- -- -- --
-- -- -- --
200 0.2 200 0.2
-- -- -- --
mV msec mV msec
Isolation Specifications
Parameter Isolation Capacitance Isolation Resistance Isolation Voltage Symbol Ciso Riso Viso Min -- 10 -- Typ 1000 -- -- Max -- -- 1500 Unit PF M Vdc
General Specifications
Parameter Calculated MTBF (IO = 80% of IO, max TA = 25 C) RIN (Reliability Infomation Notebook) Method Weight -- Min Typ 4,537,000 13 (0.46) -- Max Unit Hours g (oz.)
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Data Sheet June 26, 2009 Feature Specifications
HW006/010/012 Series Power Modules; dc-dc Converters 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information.
Parameter Remote On/Off Signal interface (VI = VI, min to VI, max; Open collector or compatible, signal referenced to VI (-) terminal Negative Logic: Device code with suffix "1" Logic Low--Module On / Logic High--Module Off Positive Logic: If device code suffix "1" is not specified Logic Low--Module Off / Logic High--Module On Module Specifications: On/Off Current--Logic Low On/Off Voltage: Logic Low Logic High Open Collector Specifications: Leakage Current during Logic High (Von/off = 15 V) Output Low Voltage during Logic Low (Ion/Off - 1 mA) Turn-On Delay and Rise Times (IO = 80% of IO, max, VIN = 48 Vdc, TA = 25 C) Case 1: On/Off input is set to Logic high and then input power is applied (delay from instant at which VI = VI, min until VO = 10% of VO, set) Case 2: Input power is applied for at least one second and then the On/Off input is set to logic high (delay from instant at which Von/off = 0.9 V until VO = 10% of VO, set) Output voltage Rise time (time for VO to rise from 10% of VO, set to 90% of VO, set) Output voltage overshoot (IO = 80% of IO, max, VI = 48 Vdc TA = 25 C) Output voltage adjustment (see Feature Description section) Output voltage set-point adjustment range (TRIM) ALL Output Overvoltage Protection (clamp) HW012A0P1 HW012A0M1 HW012A0Y1 HW010A0G1 HW010A0F1 HW006A6A1 All VO, ovsd VO, ovsd VO, ovsd VO, ovsd VO, ovsd VO, ovsd TQ203 90 -- -- -- -- -- -- -- -- 2.0 2.3 2.3 3.1 4.0 6.1 125 110 2.8 3.2 3.2 3.7 4.6 7.0 -- %VO, set V V V V V V C Device Symbol Min Typ Max Unit
All All All All All
Ion/off Von/off Von/off Ion/off Von/off
-- -0.7 -- -- --
-- -- -- -- --
1.0 1.2 15 50 1.2
mA V V A V
All
Tdelay
--
25
--
msec
All
Tdelay
--
25
--
msec
All All
Trise
-- --
0.9 --
-- 5
msec %VO, set
Overtemperaute Protection (IO = IO, max) See Figure 44 Input Undervoltage Lockout Turn-on Threshold Turn-off Threshold
All All
-- 25
32 27
36 --
V V
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Data Sheet June 26, 2009
HW006/010/012 Series Power Modules; dc-dc Converters 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Characteristic Curves
The following figures provide typical characteristics curves for the HW012A0P1 (VO = 1.2 V) module at room temperature (TA = 25 C).
0.7 0.6
INPUT CURRENT, II (A)
0.5 0.4 0.3 0.2 0.1 IO = 0.15A 0 25 30 35 40 45 50 55 60 INPUT VOLTAGE, VI (V) 65 70 75 IO = 6A
IO = 12A
OUTPUT CURRENT, IO (A) (2 A/div)
OUTPUT VOLTAGE, VO (V) (200 mV/div)
TIME, t (200 s/div)
Figure 1. Input Voltage and Current Characteristics.
Figure 4.
Transient Response to Step Decrease in Load from 50% to 25% of Full Load (VI = 48 Vdc).
86 84
(%)
82 80 78 76 74 72
VI = 36V VI = 48V
EFFICIENCY,
VI = 75V 70 0 2 4 6 8 OUTPUT CURRENT, IO (A) 10 12
OUTPUT CURRENT, IO (A) (5 A/div)
OUTPUT VOLTAGE, VO (V) (200 mV/div)
TIME, t (200 s/div)
Figure 2. Converter Efficiency vs. Output Current.
Figure 5.
Transient Response to Step Increase in Load from 50% to 75% of Full Load (VI = 48 Vdc).
OUTPUT VOLTAGE, VO (V) (10 mV/div)
TIME, t (1 s/div)
REMOTE ON/OFF, VON/OFF (V) (5 V/div)
OUTPUT VOLTAGE, VO (V) (1 V/div)
TIME, t (10 ms/div)
Figure 3.
Output Ripple Voltage (IO = IO, max).
Figure 6.
Start-up from Remote On/Off (IO = IO, max). 6
Lineage Power
Data Sheet June 26, 2009 Characteristic Curves
HW006/010/012 Series Power Modules; dc-dc Converters 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
The following figures provide typical characteristics curves for the HW012A0M1 (VO = 1.5 V) module at room temperature (TA = 25 C)
0.9 0.8
INPUT CURRENT, II (A)
0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 25 30 35 40 IO = 0.15A 45 50 55 60 INPUT VOLTAGE, VI (V) 65 70 75 IO = 6A IO = 12A
OUTPUT CURRENT, IO (A) (2 A/div)
OUTPUT VOLTAGE, VO (V) (100 mV/div)
TIME, t (200 ms/div)
Figure 7. Input Voltage and Current Characteristics.
Figure 10. Transient Response to Step Decrease in Load from 50% to 25% of Full Load (VI = 48 Vdc).
90 88 86
(%)
84 82 80 78 76 74 72 70 0 2 4 6 8 10 12 VI = 36V VI = 48V VI = 75V
EFFICIENCY,
OUTPUT CURRENT, IO (A)
OUTPUT CURRENT, IO (A) (5 A/div)
OUTPUT VOLTAGE, VO (V) (100 mV/div)
TIME, t (200 ms/div)
Figure 8. Converter Efficiency vs. Output Current.
Figure 11. Transient Response to Step Increase in Load from 50% to 75% of Full Load (VI = 48 Vdc).
OUTPUT VOLTAGE, VO (V) (10 mV/div)
TIME, t (1 s/div)
REMOTE ON/OFF, VON/OFF (V) (5 V/div)
OUTPUT VOLTAGE, VO (V) (0.5 V/div)
TIME, t (10 ms/div)
Figure 9.
Output Ripple Voltage (IO = IO, max).
Figure 12. Start-up from Remote On/Off (IO = IO, max).
Lineage Power
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Data Sheet June 26, 2009 Characteristic Curves
HW006/010/012 Series Power Modules; dc-dc Converters 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
The following figures provide typical characteristics curves for the HW012A0Y1 (VO = 1.8 V) module at room temperature (TA = 25 C)
1.2
INPUT CURRENT, II (A)
1 0.8 0.6 0.4 0.2 IO = 0.15A 0 25 30 35 40 45 50 55 60 INPUT VOLTAGE, VI (V) 65 70 75 IO = 12A
IO = 6A
OUTPUT CURRENT, IO (A) (2 A/div)
OUTPUT VOLTAGE, VO (V) (100 mV/div)
TIME, t (200 ms/div)
Figure 13. Input Voltage and Current Characteristics.
Figure 16. Transient Response to Step Decrease in Load from 50% to 25% of Full Load (VI = 48 Vdc).
90 88 86
(%)
84 82 80 78 76 74 72 70 0 2 4 6 8 OUTPUT CURRENT, IO (A) 10 12 VI = 36V VI = 48V VI = 75V
EFFICIENCY,
OUTPUT CURRENT, IO (A) (5 A/div)
OUTPUT VOLTAGE, VO (V) (100 mV/div)
TIME, t (200 ms/div)
Figure 14. Converter Efficiency vs. Output Current.
Figure 17. Transient Response to Step Increase in Load from 50% to 75% of Full Load (VI = 48 Vdc).
OUTPUT VOLTAGE, VO (V) (10 mV/div)
TIME, t (1 s/div)
REMOTE ON/OFF, VON/OFF (V) (5 V/div)
OUTPUT VOLTAGE, VO (V) (1 V/div)
TIME, t (10 ms/div)
Figure 15. Output Ripple Voltage (IO = IO, max).
Figure 18. Start-up from Remote On/Off (IO = IO, max).
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Data Sheet June 26, 2009 Characteristic Curves
HW006/010/012 Series Power Modules; dc-dc Converters 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
The following figures provide typical characteristics curves for the HW010A0G1 (VO = 2.5 V) module at room temperature (TA = 25 C)
1.2 1 0.8 0.6 0.4 0.2 IO = 0.05A 0 25 30 35 40 45 50 55 60 INPUT VOLTAGE, VI (V) 65 70 75 IO = 10A
INPUT CURRENT, II (A)
IO = 5A
OUTPUT CURRENT, IO (A) (5 A/div)
OUTPUT VOLTAGE, VO (V) (100 mV/div)
TIME, t (100 s/div)
Figure 19. Input Voltage and Current Characteristics.
Figure 22. Transient Response to Step Decrease in Load from 50% to 25% of Full Load (VI = 48 Vdc).
95 90
(%)
85
EFFICIENCY,
80 75 70 0 VI = 36V VI = 48V VI = 75V 1 2 3 4 5 6 7 OUTPUT CURRENT, IO (A) 8 9 10
OUTPUT CURRENT, IO (A) (5 A/div)
OUTPUT VOLTAGE, VO (V) (100 mV/div)
TIME, t (100 s/div)
Figure 20. Converter Efficiency vs. Output Current.
Figure 23. Transient Response to Step Increase in Load from 50% to 75% of Full Load (VI = 48 Vdc).
OUTPUT VOLTAGE, VO (V) (10 mV/div)
TIME, t (1 s/div)
REMOTE ON/OFF, VON/OFF (V) (5 V/div)
OUTPUT VOLTAGE, VO (V) (500 mV/div)
TIME, t (5 ms/div)
Figure 21. Output Ripple Voltage (IO = IO, max).
Figure 24. Start-up from Remote On/Off (IO = IO, max). 9
Lineage Power
Data Sheet June 26, 2009 Characteristic Curves
HW006/010/012 Series Power Modules; dc-dc Converters 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
The following figures provide typical characteristics curves for the HW010A0F1 (VO = 3.3 V) module at room temperature (TA = 25 C)
1.6 1.4
INPUT CURRENT, II (A)
1.2 1 0.8 0.6 0.4 0.2 0 25 30 35 40 IO = 5A IO = 10A
IO = 0.05A 45 50 55 60 INPUT VOLTAGE, VI (V) 65 70 75
OUTPUT CURRENT, IO (A) (5 A/div)
OUTPUT VOLTAGE, VO (V) (200 mV/div)
TIME, t (100 s/div)
Figure 25. Input Voltage and Current Characteristics.
Figure 28. Transient Response to Step Decrease in Load from 50% to 25% of Full Load (VI = 48 Vdc).
95 90
(%)
85 80 75 70 VI = 36V VI = 48V VI = 75V 0 1 2 3 4 5 6 7 OUTPUT CURRENT, IO (A) 8 9 10
EFFICIENCY,
OUTPUT CURRENT, IO (A) (5 A/div)
OUTPUT VOLTAGE, VO (V) (200 mV/div)
TIME, t (100 s/div)
Figure 26. Converter Efficiency vs. Output Current.
Figure 29. Transient Response to Step Increase in Load from 50% to 75% of Full Load (VI = 48 Vdc).
OUTPUT VOLTAGE, VO (V) (20 mV/div)
TIME, t (1 s/div)
REMOTE ON/OFF, VON/OFF (V) (5 V/div)
OUTPUT VOLTAGE, VO (V) (1 V/div)
TIME, t (5 ms/div)
Figure 27. Output Ripple Voltage (IO = IO, max).
Figure 30. Start-up from Remote On/Off (IO = IO, max).
Lineage Power
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Data Sheet June 26, 2009 Characteristic Curves
HW006/010/012 Series Power Modules; dc-dc Converters 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
The following figures provide typical characteristics curves for the HW006A6A1 (VO = 5.0 V) module at room temperature (TA = 25 C)
1.4 1.2
INPUT CURRENT, II (A)
1 0.8 0.6 0.4 0.2 IO = 0.05A 0 25 30 35 40 45 50 55 60 INPUT VOLTAGE, VI (V) 65 70 75 IO = 3.3A IO = 6.6A
OUTPUT CURRENT, IO (A) (2 A/div)
OUTPUT VOLTAGE, VO (V) (200 mV/div)
TIME, t (100 s/div)
Figure 31. Input Voltage and Current Characteristics.
Figure 34. Transient Response to Step Decrease in Load from 50% to 25% of Full Load (VI = 48 Vdc).
95 90
(%)
EFFICIENCY,
85 80 75 70 0 VI = 36V VI = 48V VI = 75V 1 2 3 4 5 OUTPUT CURRENT, IO (A) 6 7
OUTPUT CURRENT, IO (A) (2 A/div)
OUTPUT VOLTAGE, VO (V) (200 mV/div)
TIME, t (100 s/div)
Figure 32. Converter Efficiency vs. Output Current.
Figure 35. Transient Response to Step Increase in Load from 50% to 75% of Full Load (VI = 48 Vdc).
OUTPUT VOLTAGE, VO (V) (10m V/div)
TIME, t (1 s/div)
REMOTE ON/OFF, VON/OFF (V) (5 V/div)
OUTPUT VOLTAGE, VO (V) (2 V/div)
TIME, t (5 ms/div)
Figure 33. Output Ripple Voltage (IO = IO, max).
Figure 36. Start-up from Remote On/Off (IO = IO, max). 11
Lineage Power
Data Sheet June 26, 2009 Test Configurations
TO OSCILLOSCOPE
HW006/010/012 Series Power Modules; dc-dc Converters 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A Safety Considerations
For safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e., UL60950, CSA C22.2 No. 60950-00, and VDE 0805:2001-12 (IEC60950, 3rd Ed). These converters have been evaluated to the spacing requirements for Basic Insulation, per the above safety standards. For Basic Insulation models ("-B" Suffix), 1500 Vdc is applied from VI to VO to 100% of outgoing production. For end products connected to -48 Vdc, or -60 Vdc nomianl DC MAINS (i.e. central office dc battery plant), no further fault testing is required. Note:-60 V dc nominal bettery plants are not available in the U.S. or Canada. For all input voltages, other than DC MAINS, where the input voltage is less than 60 Vdc, if the input meets all of the requirements for SELV, then:
SCOPE RESISTIVE LOAD
n
LTEST 12 H CS 220 F ESR < 0.1 @ 20 C, 100 kHz
CURRENT PROBE VI(+)
BATTERY
33 F ESR < 0.7 @ 100 kHz VI(-)
Note: Measure input reflected ripple current with a simulated source inductance (LTEST) of 12H. Capacitor CS offsets possible battery impedance. Measure current as shown above.
Figure 37. Input Reflected Ripple Current Test Setup.
COPPER STRIP VO(+) 1.0 F VO(-) 10 F
The output may be considered SELV. Output voltages will remain withing SELV limits even with internally-generated non-SELV voltages. Single component failure and fault tests were performed in the power converters. One pole of the input and one pole of the output are to be grounded, or both circuits are to be kept floating, to maintain the output voltage to ground voltage within ELV or SELV limits.
GROUND PLANE
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Note: Scope measurements should be made using a BNC socket, with a 10 F tantalum capacitor and a 1 F ceramic capcitor. Position the load between 51 mm and 76 mm (2 in and 3 in) from the module
Figure 38. Peak-to-Peak Output Ripple Measurement Test Setup.
For all input sources, other than DC MAINS, where the input voltage is between 60 and 75 Vdc (Classified as TNV-2 in Europe), the following must be adhered to, if the converter's output is to be evaluated for SELV:
n
CONTACT AND DISTRIBUTION LOSSES
n
The input source is to be provided with reinforced insulation from any hazardous voltage, including the AC mains. One VI pin and one VO pin are to be reliably earthed, or both the input and output pins are to be kept floating. Another SELV reliability test is conducted on the whole system, as required by the safety agencies, on the combination of supply source and the subject module to verify that under a single fault, hazardous voltages do not appear at the module's output.
VI(+) II SUPPLY VI(-) CONTACT RESISTANCE
VO(+) IO LOAD
n
VO(-)
Note: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance.
The power module has ELV (extra-low voltage) outputs when all inputs are ELV. All flammable materials used in the manufacturing of these modules are rated 94V-0, and UL60950A.2 for reduced thicknesses. The input to these units is to be provided with a maximum 5A time-delay in the unearthed lead.
Figure 39. Output Voltage and Efficiency Test Setup.
[ V O(+) - V O(-) ] x I O = ------------------------------------------------ x 100 [ V I(+) - V I(-) ] x I I
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Data Sheet June 26, 2009 Design Considerations
Input Source Impedance
HW006/010/012 Series Power Modules; dc-dc Converters 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Output Voltage Set-Point Adjustment (Trim)
Output voltage trim allows the user to increase or decrease the output voltage set point of a module. This is accomplished by connecting an external resistor between the TRIM pin and either the VO(+) or VO(-) pins. The trim resistor should be positioned close to the module. If not using the trim feature, leave the TRIM pin open. With an external resistor Trim-down between the TRIM and VO(-) pins, the output voltage set point VO, set decreases (see Figure 41). The following equation determines the required external-resistor value to trim-down the output voltage from VO, set to VO:
The power module should be connected to a low ac-impedance source. A highly inductive source impedance can affect the stability of the power module. For the test configuration in Figure 37, a 33F electrolytic capacitor (ESR<0.7W at 100kHz), mounted close to the power module helps ensure the stability of the unit. Consult the factory for further application guidelines.
Feature Descriptions
Remote On/Off
Two remote On/Off options are available. Positive logic remote On/Off turns the module on during a logic-high voltage on the remote ON/OFF pin, and off during a logic low. Negative logic remote On/Off, device code suffix "1", turns the module off during logic-high voltage and on during a logic low. To turn the power module on and off, the user must supply a switch to control the voltage between the ON/OFF pin and the VI(-) terminal. The switch may be an open collector or equivalent (see Figure 40). A logic low is Von/off = -0.7 V to 1.2 V. The maximum Ion/off during a logic low is 1 mA. The switch should maintain a logic-low voltage while sinking 1 mA. During a logic high, the maximum Von/off generated by the power module is 15 V. The maximum allowable leakage current of the switch at Von/off = 15 V is 50 A. If not using the remote on/off feature, do one of the following: For positive logic, leave the ON/OFF pin open. For negative logic, short the ON/OFF pin to VI(-).
Ion/off ON/OFF +
A R trim-down = -------- - B k %
Rtrim-down is the external resistor in kW D% is the % change in output voltage A & B are defined in Table 1 for various models Table 1
Output Voltage (V) 1.2 1.5 1.8 2.5 3.3 5.0
A 1089 1089 1089 1690 1690 1690
B 62.0 104 104 73.1 73.1 73.1
For example, to trim-down the output voltge of 2.5 V module (HW010A0G) by 8% to 2.3 V, Rtrim-down is calculated as follows: D% = 8 A = 1690 B = 73.1
Von/off - VO(+) LOAD VI(+) VI(-) VO(-)
1690 R trim-down = ----------- - 73.1 k 8 R trim - down = 138.15k
Figure 40. Remote On/Off Implementation.
Lineage Power
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Data Sheet June 26, 2009 Feature Descriptions (continued)
HW006/010/012 Series Power Modules; dc-dc Converters 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Output Voltage Set-Point Adjustment (Trim) (continued)
VI(+) ON/OFF
VO(+) Rtrim-up TRIM RLOAD
VI(+) ON/OFF
VO(+)
VI(-) VO(-)
TRIM VI(-) VO(-) Rtrim-down
RLOAD
Figure 42. Circuit Configuration to Increase Output Voltage. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (maximum rated power = VO, set x IO, max).
Figure 41. Circuit Configuration to Decrease Output Voltage. With an external resistor Rtrim-up, connected between the TRIM and VO(+) pins, the output voltage set point VO, set increases (see Fiugre 42). The following equation determines the required external-resistor value to trim-up the output voltage from VO, set to VO:
Overcurrent Protection
To provide protection in an output overload fault condition, the module is equipped with internal current-limiting circuitry, and can endure current limiting for an unlimited duration. At the instance of current-limit inception, the module enters a "hiccup" mode of operation, whereby it shuts down and automatically attempts to restart. While the fault condition exists, the module will remain in this mode until the fault is cleared. The unit operates normally once the output current is reduced back into its specified range.
A ( 100 + % ) - B R trim-up = ------------------------------------------ - C k %
Rtrim-up is the external resistor in kW D% is the % change in output voltage A, B and C are defined in Table 2 Table 2 Output Voltage (V) 1.2 1.5 1.8 2.5 3.3 5.0 A 15.9 19.8 23.8 34.5 45.5 69.0 B 1089 1089 1089 1690 1690 1690 C 62.0 104 104 73.1 73.1 73.1
Output Overvoltage Protection
The output overvoltage protection clamp consists of control circuitry, independent of the primary regulation loop, that monitors the voltage on the output terminals. This control loop has a higher voltage set point than the primary loop (See the overvoltage clamp values in the Feature Specifications Table). In a fault condition, the overvoltage clamp ensures that the output voltage does not exceed VO, ovsd, max. This provides a redundant voltage-control that reduces the risk of output overvoltage.
For example, to trim-up the output voltage of 1.5 V module (HW012A0M) by 8% to 1.62 V, Rtrim-up is calcualted is as follows: D% = 8 A = 19.8 B = 1089 C = 104
19.8 ( 100 + 8 ) - 1089 R trim-up = --------------------------------------------------- - 104 k 8 R trim-up = 27.175k
Lineage Power 14
Data Sheet June 26, 2009 Feature Descriptions (continued)
Overtemperature Protection
HW006/010/012 Series Power Modules; dc-dc Converters 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
To provide protection under certain fault conditios, the unit is equipped with a thermal shutdown circuit. The unit will shudown if the overtemperature threshold is exceeded, but the thermal shut down is not intended as a guarantee that the unit will survive temperatures beyond its rating. The module will automatically restart after it cools down.
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout limit, the module operation is disabled. The module will begin to operate at an input voltage above the undervoltage lockout turn-on threshold.
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15
Data Sheet June 26, 2009 Thermal Considerations
HW006/010/012 Series Power Modules; dc-dc Converters 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
12 10
Output Current IO (A)
The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation of the unit. Heat is removed by conduction, convection, and radiation to the surrounding environment. Proper cooling can be verified by measuring drain pin Q203 at the position indicated in Figure 43. The temperature at Q203 drain pins should not exceed 115 C. The output power of the module should not exceed the rated power for the module (VO, set x IO, max). Although the maximum operating ambient temperature of the power modules is 85 C, you can limit this temperature to a lower value for extremely high reliability.
8 6 4 2 0 2.0 m/s (400 ft./min.) 1.0 m/s (200 ft./min.) 0.5 m/s (100 ft./min.) NATURAL CONVECTION
20
30
40
50 60 70 Ambient Temperature TA (C)
80
90
Figure 44. Derating Curves for HW010A0F1 (VO = 3.3 V) in Transverse Orientation (VI = 48 Vdc).
8 7
OUTPUT CURRENT, IO (A)
6 5 4 3 2 1 0 20 30 40 50 60 70 AMBIENT TEMPERATURE, TA (C) 80 90 2.0 m/s (400 ft./min.) 1.0 m/s (200 ft./min.) 0.5 m/s (100 ft./min.) NATURAL CONVECTION
Q203
Attach thermocouple to drain lead. AIRFLOW
Figure 43. HW 6.6A-12A-Series Temperature Measurement Location (Top View).
Heat Transfer via Convection
Increasing airflow over the module enhances the heat transfer via convection. Figures 44--48 show the maximum current that can be delivered by various modules versus local ambient temperature (TA) for natural convection through 2 m/ s (400 ft./min.). Systems in which these power modules may be used typically generate natural convection airflow rates of 0.3 ms-1 (60 ft./min.) due to other heat-dissipating components in the system. Therefore, the natural convection condition represents airflow rates of up to 0.3 ms-1 (60 ft./min.). Use of Figure 44 is shown in the following example. Example What is the minimum airflow necessary for a HW010A0F1 operating at VIN = 48 V, an output current of 10 A, and a maximum ambient temperature of 75 C. Solution Given: VIN = 48V IO = 12 A TA = 75 C v = 0.5 m/s (100 ft./min.) Lineage Power
Figure 45. Derating Curves for HW006A6A1 (VO = 5.0 V) in Transverse Orientation (VI = 48 Vdc).
11 10
OUTPUT CURRENT, IO (A)
9 8 7 6 5 4 3 2 1 0 20 30 40 50 60 70 AMBIENT TEMPERATURE, TA (C) 80 90 2.0 m/s (400 ft./min.) 1.0 m/s (200 ft./min.) 0.5 m/s (100 ft./min.) NATURAL CONVECTION
Figure 46. Derating Curves for HW010A0G1 (VO = 2.5 V) in Transverse Orientation (VI = 48 Vdc).
Determine airflow (v) (Use Figure 44.):
16
Data Sheet June 26, 2009 Thermal Considerations (continued)
HW006/010/012 Series Power Modules; dc-dc Converters 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Figure 47. Derating Curves for HW012A0Y1 (VO = 1.8 V) in Transverse Orientation (VI = 48 Vdc).
Figure 48. Derating Curves for HW012A0P1 (VO = 1.2 V) in Transverse Orientation (VI = 48 Vdc).
Layout Considerations
Copper paths must not be routed beneath the power module. For additional layout guidelines, refer to the FLTR100V10 or FLTR100V20 data sheet.
EMC Considerations
For assistance with designing for EMC compliance, please refer to the FLTR100V10 data sheet (FDS01-043EPS)
Lineage Power
17
Data Sheet June 26, 2009
HW006/010/012 Series Power Modules; dc-dc Converters 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
sure and placement speed should be considered to optimize this process. The minimum recommended nozzle diameter for reliable operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 9 mm. Oblong or oval nozzles up to 11 x 9 mm may also be used within the space available. For further information please contact your local Lineage Power Technical Sales Representative.
Through-Hole Lead-Free Soldering Information
The RoHS-compliant through-hole products use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. They are designed to be processed through single or dual wave soldering machines. The pins have an RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept below 210C. For Pb solder, the recommended pot temperature is 260C, while the Pb-free solder pot is 270C max. Not all RoHS-compliant through-hole products can be processed with paste-through-hole Pb or Pb-free reflow process. If additional information is needed, please consult with your Lineage Power representative for more details.
Reflow Soldering Information
The HW006 family of power modules is available for either Through-Hole (TH) or Surface Mount (SMT) soldering. These power modules are large mass, low thermal resistance devices and typically heat up slower than other SMT components. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each application board assembly. The following instructions must be observed when SMT soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability. The surface mountable modules in the HW006 family use our newest SMT technology called "Column Pin" (CP) connectors. Figure 50 shows the new CP connector before and after reflow soldering onto the end-board assembly.
Surface Mount Information
Pick and Place Area
Although the module weight is minimized by using openframe construction, the modules have a relatively large mass compared to conventional surface-mount components. To optimize the pick-and-place process, automated vacuum equipment variables such as nozzle size, tip style, vacuum pressure, and placement speed should be considered. Surface-mount versions of this family have a flat surface which serves as a pick-and-place location for automated vacuum equipment. The module's pick-and-place location is identified in Figure 49.
HW006 Board
Insulator Solder Ball
X
14mm (0.57in)
End assembly PCB
21mm (0.84in)
Figure 49. Pick and Place Location.
Z Plane Height The 'Z' plane height of the pick and place location is 7.50mm nominal with an RSS tolerance of +/-0.25 mm.
Nozzle Recommendations
The module weight has been kept to a minimum by using open frame construction. Even so, they have a relatively large mass when compared with conventional SMT components. Variables such as nozzle size, tip style, vacuum presLineage Power
Figure 50. Column Pin Connector Before and After Reflow Soldering. The CP is constructed from a solid copper pin with an integral solder ball attached, which is composed of tin/lead (Sn/Pb) solder. The CP connector design is able to compensate for large amounts of co-planarity and still ensure a reliable SMT solder joint. Typically, the eutectic solder melts at 183oC, wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. For reliable soldering the solder reflow profile should be established by accurately measuring the modules CP connector temperatures.
18
Data Sheet June 26, 2009
HW006/010/012 Series Power Modules; dc-dc Converters 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
ages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of < 30C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag seal date, when stored at the following conditions: < 40 C, < 90% relative humidity.
300
Peak Temp 235 oC
250
200
Heat zone max 4oCs -1
Cooling zone o 1-4 Cs -1
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to Lineage Power Board Mounted Power Modules: Soldering and Cleaning Application Note (AP01-056EPS).
Per J-STD-020 Rev. C 300 Peak Temp 250 Cooling Zone * Min. Time Above 235C Heating Zone *Time Above 217C
150
100
Soak zone 30-240s Preheat zone max 4oCs -1
REFLOW TIME (S)
Tlim above 205 o C
50
0
Figure 51. Recommended Reflow profile.
240
Reflow Temp (C)
235 230 225 220 215 210
200 150 100 50 0
205 200 0 10 20 30 TIME (S) 40 50 60
Reflow Time (Seconds)
Figure 53. Recommended linear reflow profile using Sn/ Ag/Cu solder.
Figure 52. Time Limit curve above 2050C.
Solder Ball and Cleanliness Requirements
The open frame (no case or potting) power module will meet the solder ball requirements per J-STD-001B. These requirements state that solder balls must neither be loose nor violate the power module minimum electrical spacing. The cleanliness designator of the open frame power module is C00 (per J specification).
Lead Free Soldering
The -Z version SMT modules of the HW/HC series are leadfree (Pb-free) and RoHS compliant and are compatible in a Pb-free soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C (Moisture/ Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Figure. 53.
MSL Rating
The HW series SMT modules have a MSL rating of 1.
Storage and Handling
The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packLineage Power 19
Data Sheet June 26, 2009
HW006/010/012 Series Power Modules; dc-dc Converters 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Outline Diagram for Surface-Mount Module
Dimensions are in millimeters and (inches). Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) [unless otherwise indicated] x.xx mm 0.25 mm (x.xxx in. 0.010 in.)
47.2 (1.86)
Top View
29.5 (1.16) 0.06 x 0.06 chamffer
2.54 (0.100) min stand-off height
8.50 (0.335) MAX
Side View
0.5 (.020) max compliance 1.7 (0.07)
3.6 (0.14) TRIM VO+ VO-
Bottom View
26.16 (1.030)
VI+ VI5.00 (0.197)
On/Off
35.00 (1.375) 40.00 (1.575)
Lineage Power
20
Data Sheet June 26, 2009
HW006/010/012 Series Power Modules; dc-dc Converters 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Outline Diagram for Through-Hole Module
Dimensions are in millimeters and (inches). Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) [unless otherwise indicated] x.xx mm 0.25 mm (x.xxx in. 0.010 in.)
Lineage Power
21
Data Sheet June 26, 2009
HW006/010/012 Series Power Modules; dc-dc Converters 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Recommended Pad Layout for Surface-Mount Module and Recommended Hole Layout for Through-Hole Module
Component-side footprint. Dimensions are in millimeters and (inches), unless otherwise noted.
38.63 (1.521) 43.64 (1.718) 47.24 (1.860) 3.63 (0.143) 8.64 (0.340)
29.46 (1.160) 27.84 (1.096)
0 (0)
20.73 (0.816)
KEEP-OUT AREA:
Besides trace to ON/OFF pin, do not route other traces on the PWB top layer closest to the power module in this keep-out area. 0 (0)
1.68 (0.066) 0 (0)
0 (0)
NOTES: 1. FOR CGA SURFACE MOUNT PIN USE THE FOLLOWING PAD
0.022" DIA VIA 0.032" DIA SOLDER MASK OPENING 4 PLACES FOR OUTPUT PINS 2 PLACES FOR INPUT PINS 0.025" SPACING VIA TO PAD 0.015" MIN SOLDER MASK WALL
0.105" PASTE MASK OPENING 0.110" SOLDER MASK OPENING
Lineage Power
32.56 (1.282)
22
Data Sheet June 26, 2009 Ordering Information
HW006/010/012 Series Power Modules; dc-dc Converters 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Please contact your Lineage Power Sales Representative for pricing, availability and optional features. Table 1. Device Codes Input Voltage 36 - 75 Vdc 36 - 75 Vdc 36 - 75 Vdc 36 - 75 Vdc 36 - 75 Vdc 36 - 75 Vdc 36 - 75 Vdc 36 - 75 Vdc 36 - 75 Vdc 36 - 75 Vdc 36 - 75 Vdc 36 - 75 Vdc 36 - 75 Vdc 36 - 75 Vdc 36 - 75 Vdc 36 - 75 Vdc 36 - 75 Vdc 36 - 75 Vdc 36 - 75 Vdc 36 - 75 Vdc Output Voltage 1.2 V 1.5 V 1.8 V 2.5 V 3.3 V 3.3 V 5.0 V 5.0 V 1.2 V 1.2 V 1.5 V 1.5 V 1.8 V 1.8 V 2.5 V 3.3 V 3.3 V 5.0 V 5.0 V 5.0 V Output Current 12 A 12 A 12 A 10 A 10 A 10 A 6A 6A 12 A 12 A 12 A 12 A 12 A 12 A 10 A 10 A 10 A 6A 6A 6A Efficiency 82 83 85 89 90 90 91 91 82 82 83 83 85 85 89 90 90 91 91 91 Connector Type Through-Hole Through-Hole Through-Hole Through-Hole Through-Hole Through-Hole Through-Hole Through-Hole SMT SMT SMT SMT SMT SMT SMT SMT SMT SMT SMT SMT Device Code HW012A0P1 HW012A0M1 HW012A0Y1 HW010A0G1 HW010A0F1 HW010A0F1Z HW006A6A1 HW006A6A1Z HW012A0P1-S HW012A0P1-SZ HW012A0M1-S HW012A0M1-SZ HW012A0Y1-S HW012A0Y1-SZ HW010A0G1-S HW010A0F1-S HW010A0F1-SZ HW006A6A1-S HW006A6A-S HW006A6A1-SZ Comcodes 108965591 108968389 108968405 108968421 108965625 CC109107141 108968363 CC109107133 108965617 109100360 108968371 CC109101805 108968397 109100377 108968413 108967985 108995214 108968355 CC109142155 109100352
Optional features can be ordered using the suffixes shown below. The suffixes follow the last letter of the Product Code and are placed in descending alphanumerical order. Table 2. Device Options Option Negative remote on/off logic Approved for Basic Insulation Surface mount interconnections RoHS Compliant Suffix 1 -B -S -Z
A sia-Pacific Head qu art ers T el: +65 6 41 6 4283
World W ide Headq u arters Lin eag e Po wer Co rp oratio n 30 00 Sk yline D riv e, Mesquite, T X 75149, U SA +1-800-526-7819 (Outs id e U .S.A .: +1- 97 2-2 84 -2626) www.line ag ep ower.co m e-m ail: tech sup port1@ lin ea gep ower.co m
Eu ro pe, M id dle-East an d Afric a He ad qu arters T el: +49 8 9 6089 286
Ind ia Head qu arters T el: +91 8 0 28411633
Lineage Power reserves the right to make changes to the produc t(s) or information contained herein without notice. No liability is ass umed as a res ult of their use or applic ation. No rights under any patent acc ompany the sale of any s uc h pr oduct(s ) or information. (c) 2008 Lineage Power Corpor ation, (Mesquite, Texas ) All International Rights Res er ved.
Document No: ADS02-006EPS ver.1.4 PDF Name: fds03-0031.pdf


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